The automated system fixes large circuit boards with one click, cleaning, placing, and soldering parts quickly and safely for various industries.
ZEVAC has introduced the ONYX 1000, which the company claims is the only truly fully automated All in One rework solution on a large platform capable of completing the entire process with a single click. The process includes component removal, site cleaning using ZEVAC’s contactless technology to maintain pad safety & surface quality and solder paste dispensing with an integrated dispensing head (optional). Components are automatically picked up from tape feeders and waffle trays without manual intervention.
The solution is designed for every kind of electronics manufacturer, OEMs, contract manufacturers and repair centres that work with complex components/devices and/or large-format PCBs and require a fully automated rework solution. It is particularly suited for industries such as aerospace, defence, medical devices, automotive electronics and telecommunications, where precision, repeatability, and protection of sensitive components are critical. Research and development labs and prototyping facilities can also benefit from its hands-free operation and process consistency, making it suitable for environments that demand high reliability, minimal manual intervention, and comprehensive process control.
The system handles component alignment and positioning using 360° rotatable heads and performs the soldering process according to predefined temperature profiles. All steps are supported by closed-loop control systems and software designed for operation and process management.
Some of the key features of the ONYX 1000 include:
- Large board handling for PCBs up to 630 mm x 800 mm.
- Flexible board carrier for easy handling of irregularly shaped assemblies without additional fixtures.
- Automatic closed-loop force control of the Z-axis for automatic pick and place, contactless site cleaning, fluxing, dispensing, soldering processes in order to protect sensitive parts.
- All axes motorized with closed-loop motion control.
- Multifunctional robot head combining hot gas head + SMT pick & place head.
- Up to four automatic tool changers for the hot gas head and the pick & place head.
- MFOV system for high resolution inspection of components up to 70 mm x 70 mm (optional 110 mm x 110 mm).
- 800 W multi-function hot gas heater head:
Solder components, remove components, site clean (contactless and automatic removal of residual solder). - Adjustable bottom preheaters with a performance of up to 12’000 W including integrated board cooling.
- High precision closed-loop Hot Air/Hot gas flow control from 8 to 80 l/min.
- Automatic contactless site cleaning for removal of residual solder with a motorized X / Y / Z system.
- Integrated dispensing head (optional).
- Automatic reballing system (optional).
- Automatic feeders and waffle trays for component feeding.
- Integrated dipping station for flux and solder paste.
- Eight thermocouple ports for process temperature control.
