A new 1GHz microprocessor with integrated 128MB DDR3L SDRAM delivers smooth video, rich graphics, and responsive user interfaces for next-gen appliances, industrial systems, and smart building controls—while cutting system costs and easing PCB design.
Renesas Electronics Corporation has introduced the RZ/A3M, a new addition to its RTOS-based RZ/A series of microprocessors (MPUs), targeting cost-sensitive, high-performance human-machine interface (HMI) applications. Featuring a built-in 128MB DDR3L SDRAM, the RZ/A3M enables rich video and animation at up to 30fps on LCDs up to 1280×800 resolution—ideal for next-gen home appliances, industrial systems, healthcare equipment, and building automation.
Key Features:
- 1GHz Arm Cortex-A55 CP
- 128KB SRAM with ECC, 128MB DDR3L SDRAM
- WXGA (1280×800) LCD support, 2D graphics engine
- Interfaces: QSPI, USB 2.0, SPI, I2C, SDHI, I2S
- 244-pin LFBGA (17mm x 17mm, 0.8mm pitch)
It is powered by a 64-bit Arm Cortex-A55 core running at 1GHz, complemented by 128KB on-chip SRAM. Its integrated high-speed DDR3L memory simplifies system design, removing the need for external memory interface routing and reducing overall system cost. Supporting external NAND/NOR flash via QSPI, it also enables flexible storage expansion with cost-efficient NAND flash.
Designed for affordability and ease of design, the MPU’s 244-pin LFBGA package features an innovative two-row pin layout on the periphery, streamlining PCB design and allowing for a simplified, low-cost two-layer board. The company supports the RZ/A3M with a comprehensive development suite including the Flexible Software Package (FSP), evaluation kits, and tools. GUI solutions from partners like LVGL, Crank, and SquareLine Studio help developers accelerate HMI design.
“The RZ/A3M is our first RZ MPU with large built-in memory designed to handle advanced HMI graphics and video while keeping cost low,” said Daryl Khoo, VP of Embedded Processing Marketing at Renesas. “It delivers a highly responsive, high-quality user experience with reduced design complexity.”
For more information , click here.
